Molex 42002 Series Vertical Through Hole PCB Header, 6 Contact(s), 6.35 mm Pitch, 1 Row, Unshrouded
- RS-stocknr.:
- 787-137
- Fabrikantnummer:
- 10-84-4062
- Fabrikant:
- Molex
Subtotaal (1 zak van 300 eenheden)*
€ 293,96
(excl. BTW)
€ 355,69
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Nieuw product (vandaag reserveren)
- Verzending vanaf 11 maart 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Zak(ken) | Per Zak | Per stuk* |
|---|---|---|
| 1 + | € 293,96 | € 0,98 |
*prijsindicatie
- RS-stocknr.:
- 787-137
- Fabrikantnummer:
- 10-84-4062
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 42002 | |
| Product Type | PCB Header | |
| Current | 20A | |
| Pitch | 6.35mm | |
| Number of Contacts | 6 | |
| Housing Material | Nylon | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Bronze | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 42002 | ||
Product Type PCB Header | ||
Current 20A | ||
Pitch 6.35mm | ||
Number of Contacts 6 | ||
Housing Material Nylon | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Bronze | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Standards/Approvals UL | ||
- Land van herkomst:
- IN
The Molex Header offers reliable connections for a variety of applications, ensuring robust performance and optimal signal integrity. It is designed to facilitate efficient transmission and connectivity in complex systems.
Ensures robust performance for optimal signal integrity
Facilitates efficient transmission in complex systems
Constructed for durability in demanding environments
Provides versatile connectivity options for diverse applications
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