Amphenol ICC 20021111 Series Straight Through Hole PCB Header, 16 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded
- RS-stocknr.:
- 786-383
- Fabrikantnummer:
- 20021111-00016T4LF
- Fabrikant:
- Amphenol ICC
Momenteel niet beschikbaar
We weten niet of dit artikel weer voorradig zal zijn, het wordt door de fabrikant stopgezet.
- RS-stocknr.:
- 786-383
- Fabrikantnummer:
- 20021111-00016T4LF
- Fabrikant:
- Amphenol ICC
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Amphenol ICC | |
| Series | 20021111 | |
| Product Type | PCB Header | |
| Pitch | 1.27mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 16 | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Copper | |
| Contact Material | Copper | |
| Row Pitch | 1.27mm | |
| Termination Type | Through Hole | |
| Contact Gender | Male | |
| Alles selecteren | ||
|---|---|---|
Merk Amphenol ICC | ||
Series 20021111 | ||
Product Type PCB Header | ||
Pitch 1.27mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 16 | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Copper | ||
Contact Material Copper | ||
Row Pitch 1.27mm | ||
Termination Type Through Hole | ||
Contact Gender Male | ||
- Land van herkomst:
- CN
The Amphenol Connector solution designed for varied applications, ensuring secure and efficient connectivity in demanding environments. Its robust construction and functionality support seamless integration into existing systems.
Manufactured to meet stringent industry standards for quality and performance
Features a Compact design that allows for easy installation in space-constrained areas
Constructed from Durable materials, ensuring longevity and resistance to environmental factors
Designed for high-performance applications, facilitating optimal data transmission and connectivity
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