Molex 501331 Series Vertical Surface Mount PCB Header, 13 Contact(s), 1 mm Pitch, 1 Row, Shrouded
- RS-stocknr.:
- 694-115
- Fabrikantnummer:
- 501331-1307
- Fabrikant:
- Molex
Afbeelding representeert productcategorie
Subtotaal (1 rol van 1100 eenheden)*
€ 1.276,49
(excl. BTW)
€ 1.544,55
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 29 juni 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len) | Per rol | Per stuk* |
|---|---|---|
| 1 + | € 1.276,49 | € 1,16 |
*prijsindicatie
- RS-stocknr.:
- 694-115
- Fabrikantnummer:
- 501331-1307
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 501331 | |
| Product Type | PCB Header | |
| Pitch | 1mm | |
| Current | 1A | |
| Number of Contacts | 13 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface Mount | |
| Contact Plating | Tin | |
| Contact Material | Phosphor Bronze | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS Compliant | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 501331 | ||
Product Type PCB Header | ||
Pitch 1mm | ||
Current 1A | ||
Number of Contacts 13 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface Mount | ||
Contact Plating Tin | ||
Contact Material Phosphor Bronze | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS Compliant | ||
- Land van herkomst:
- JP
The Molex 1.00mm pitch Pico-Clasp PCB header features a single row vertical surface mount design with tin plating and an inner positive lock, supporting 13 circuits in a natural color, Ideal for Compact and secure wire-to-board connections in space-constrained electronic assemblies.
Metal material used is phosphor bronze
Mating surface is plated with tin
Termination surface is plated with tin
Resin material used is nylon
Mating surface is plated with tin
Termination surface is plated with tin
Resin material used is nylon
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