Molex 44472 Series Vertical Through Hole PCB Header, 8 Contact(s), 4.20 mm Pitch, 2 Row, Shrouded

Subtotaal (1 tray van 100 eenheden)*

€ 223,66

(excl. BTW)

€ 270,63

(incl. BTW)

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  • Verzending vanaf 01 juni 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 223,66€ 2,237

*prijsindicatie

RS-stocknr.:
693-966
Fabrikantnummer:
44472-0851
Fabrikant:
Molex
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Merk

Molex

Product Type

PCB Header

Series

44472

Pitch

4.20mm

Current

11A

Number of Contacts

8

Housing Material

66 Nylon

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Plating

Tin

Contact Material

High Performance Alloy

Minimum Operating Temperature

-40°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR19980, UL E29179

Voltage

600V

Land van herkomst:
MX
The Molex Mini-Fit HCS Header is expertly designed to facilitate secure wire-to-board connections in electronic applications. Engineered with an efficient 4.20mm pitch and dual-row configuration, this header accommodates up to 8 circuits, ensuring reliable connectivity across a range of devices. Made from high-performance nylon 6/6 and complemented by a lock that incorporates a unique snap-in plastic peg, the Mini-Fit HCS provides superb durability and ease of installation. With a maximum current rating of 11.0A and a voltage capacity of 600V, it is perfectly suited for power applications while ensuring compliance with EU RoHS regulations, affirming its environmental standards. Whether you’re in engineering or product assembly, this versatile header delivers unmatched performance and dependability.

Low-halogen and compliant with EU RoHS regulations for environmental responsibility
Durability rating of 30 mating cycles, highlighting long-lasting performance
Natural (White) resin colours offers aesthetic integration into device designs
Operates effectively across a wide temperature range from -40° to +105°C
Facilitates through-hole termination style for reliable soldering during assembly

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