Molex 74099 Series Vertical Surface Mount PCB Header, 7 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

Subtotaal (1 tube van 150 eenheden)*

€ 243,68

(excl. BTW)

€ 294,85

(incl. BTW)

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  • Verzending vanaf 26 januari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 243,68€ 1,625

*prijsindicatie

RS-stocknr.:
693-407
Fabrikantnummer:
74099-1007
Fabrikant:
Molex
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Merk

Molex

Product Type

PCB Header

Series

74099

Current

3A

Pitch

2.54mm

Number of Contacts

7

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface Mount

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Brass Alloy Bronze Alloy

Minimum Operating Temperature

-40°C

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

CSA LR19980, UL E29179

Voltage

250V

Land van herkomst:
MY
The Molex SL Wire-to-Board Header is expertly designed for surface mount applications, offering a Compact and reliable connection for electronic circuits. This single-row header facilitates optimal soldering thanks to its 3.05mm pocket and is fully shrouded to ensure security and ease of use. Equipped with seven circuits, the SL header is capable of handling a maximum current of 3.0A and voltage of 250V, making it Ideal for high-performance signal interfacing. It features a gold selective plating for high durability, while its robust construction ensures compliance with various industry standards.

Surface mount design ensures efficient and secure connections
Single-row configuration allows for space-saving applications
Seven circuits support multi-functional connectivity
Gold selective plating provides superior electrical performance and reduces contact wear
Rated for a maximum current of 3.0A, enabling robust signal transmission
Operating temperature range from -40° to +105°C accommodates diverse environments
Constructed from high-temperature thermoplastic for enhanced reliability
Fully shrouded design eliminates the risk of misalignment during mating

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