Molex 53307 Series Vertical Surface Mount Connector, 16 Contact(s), 0.80 mm Pitch, 2 Row, Shrouded

Subtotaal (1 rol van 1000 eenheden)*

€ 2.025,49

(excl. BTW)

€ 2.450,84

(incl. BTW)

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  • Verzending vanaf 29 juni 2026
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RS-stocknr.:
691-916
Fabrikantnummer:
53307-1671
Fabrikant:
Molex
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Merk

Molex

Product Type

Connector

Series

53307

Current

0.5A

Pitch

0.80mm

Number of Contacts

16

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface Mount

Connector System

Board-to-Board

Contact Plating

Tin

Contact Material

Phosphor Bronze

Termination Type

Surface Mount

Row Pitch

0.80mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

EU RoHS Compliant, REACH SVHC

Voltage

50V

Land van herkomst:
JP
The Molex Slim Stack Board-to-Board Connector 0.80mm Pitch is meticulously designed for high-density applications requiring a reliable connection with minimal space. Offering a versatile mated height of 4.50mm or 5.50mm, this connector is Ideal for board-to-board interconnections in signal applications. Featuring 16 circuits and a vertical orientation, it ensures optimal signal integrity whilst maintaining compliance with various environmental standards. Constructed from high-temperature thermoplastic and phosphor bronze, the Slim Stack connector supports up to 0.5A maximum current at a voltage of 50V, making it a robust solution for modern electronic devices. Designed for surface mount termination, it not only facilitates efficient assembly but also promises durability and performance in a wide temperature range of -40° to +105°C.

Fully shrouded design protects contacts and aids in easy mating
Supports a maximum current of 0.5A and voltage of 50V for reliable performance
Complies with industry standards, ensuring environmental responsibility
Surface mount termination style simplifies PCB assembly processes
Supports 16 loaded circuits, ensuring a robust connection with minimal footprint

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