Molex 55935 Series Right Angle Through Hole PCB Header, 4 Contact(s), 2 mm Pitch, 1 Row, Shrouded
- RS-stocknr.:
- 691-515
- Fabrikantnummer:
- 55935-0430
- Fabrikant:
- Molex
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- RS-stocknr.:
- 691-515
- Fabrikantnummer:
- 55935-0430
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
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Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 55935 | |
| Product Type | PCB Header | |
| Pitch | 2mm | |
| Current | 3A | |
| Housing Material | Polyester | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 2mm | |
| Maximum Operating Temperature | 105°C | |
| Tail Pin Length | 3.2mm | |
| Contact Gender | Male | |
| Standards/Approvals | REACH SVHC | |
| Voltage | 250Vrms | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 55935 | ||
Product Type PCB Header | ||
Pitch 2mm | ||
Current 3A | ||
Housing Material Polyester | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 2mm | ||
Maximum Operating Temperature 105°C | ||
Tail Pin Length 3.2mm | ||
Contact Gender Male | ||
Standards/Approvals REACH SVHC | ||
Voltage 250Vrms | ||
- Land van herkomst:
- JP
The Molex MicroClasp Wire-to-Board Header is engineered for seamless signal transmission in Compact electronic assemblies. Featuring a right-angle design with four circuits, this versatile PCB header accommodates wire-to-board connections while ensuring robust performance in space-constrained applications. Its polyester resin construction guarantees durability, while the tin-plated mating surfaces enhance electrical conductivity. Designed for optimum compatibility, the MicroClasp header meets stringent industry standards and is suitable for a variety of applications, making it a reliable choice for engineers seeking efficient connectivity solutions.
Compact right-angle design optimises space in electronic assemblies
Four circuit capability supports efficient signal transfer
Constructed from Durable polyester resin for long-lasting use
Tin plating on mating surfaces ensures enhanced conductivity
Rated for a maximum current of 3.0A and a voltage of 250V AC/DC
Supports through-hole termination for secure PCB attachment
Designed to endure up to 30 mating cycles, ensuring dependable performance
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