Molex 41771 Series Vertical Through Hole PCB Header, 6 Contact(s), 3.96 mm Pitch, 1 Row, Unshrouded
- RS-stocknr.:
- 685-064
- Fabrikantnummer:
- 26-60-2031
- Fabrikant:
- Molex
Subtotaal (1 verpakking van 1000 eenheden)*
€ 243,90
(excl. BTW)
€ 295,12
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 19 januari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en) | Per verpakking | Per stuk* |
|---|---|---|
| 1 + | € 243,90 | € 0,244 |
*prijsindicatie
- RS-stocknr.:
- 685-064
- Fabrikantnummer:
- 26-60-2031
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 41771 | |
| Product Type | PCB Header | |
| Current | 7A | |
| Pitch | 3.96mm | |
| Housing Material | Polyester | |
| Number of Contacts | 6 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Row Pitch | 3.96mm | |
| Termination Type | Solder | |
| Tail Pin Length | 3.56mm | |
| Standards/Approvals | RoHS | |
| Voltage | 250 V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 41771 | ||
Product Type PCB Header | ||
Current 7A | ||
Pitch 3.96mm | ||
Housing Material Polyester | ||
Number of Contacts 6 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Row Pitch 3.96mm | ||
Termination Type Solder | ||
Tail Pin Length 3.56mm | ||
Standards/Approvals RoHS | ||
Voltage 250 V | ||
- Land van herkomst:
- IN
The Molex flat vertical header assembly is specifically designed for seamless connectivity in electronic applications. Featuring a robust construction with glass-filled polyester, this component ensures reliability and durability in demanding environments. It accommodates standard solderability practices, achieving excellent performance while maintaining compliance with cosmetic specifications. Its stackable design promotes efficient space management on circuit boards, making it an optimal choice for modern electronics. This header is engineered to withstand various mechanical stresses and is compatible with multiple wiring configurations, offering versatility for designers and engineers. Whether for prototype development or mass assembly, this header assembly delivers exceptional functionality.
Constructed from glass-filled polyester ensuring durability
Meets overall refloated matte tin specifications for enhanced performance
Supports a pin push-out force of 3 lbs minimum prior to soldering
Stackable design allows for efficient end to end component placement
Compatible with various PC board hole layouts for easy integration
Features void-free circuits for reliable electrical connections
Conforms to class B requirements of cosmetic specifications
Recommended for high-quality electronic assemblies in diverse markets
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