Molex 4455 Series Vertical PCB PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

Subtotaal (1 tray van 300 eenheden)*

€ 246,85

(excl. BTW)

€ 298,69

(incl. BTW)

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  • Verzending vanaf 19 januari 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 246,85€ 0,823

*prijsindicatie

RS-stocknr.:
684-829
Fabrikantnummer:
22-02-2085
Fabrikant:
Molex
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Merk

Molex

Series

4455

Product Type

PCB Header

Pitch

2.54mm

Current

2.5A

Housing Material

Nylon

Number of Contacts

8

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

PCB

Contact Plating

Tin

Contact Material

Brass

Termination Type

Solder

Row Pitch

2.54mm

Tail Pin Length

3.35mm

Standards/Approvals

RoHS

Voltage

500 V

Land van herkomst:
MY
The Molex KK 254 PC Board Connector designed for seamless board-to-board signal connections, facilitating a reliable and efficient interface for electronic assemblies. With its compact 2.54mm pitch and top-entry orientation, this connector is suitable for various applications, ensuring secure and stable connections within electronic devices. Engineered with quality materials, it features a natural white nylon resin and brass metal, ensuring durability and performance. The connector supports up to 8 circuits, making it ideal for applications that require multiple signal pathways while maintaining a low profile on the PCB. With impressive compliance to several industry standards, the KK 254 guarantees compatibility and reliability in all environments.

Supports up to 8 circuits for efficient signal transmission

Constructed with durable nylon resin and brass metal for longevity

Top entry design optimises space on PCBs, enhancing layout flexibility

Complies with EU RoHS and other environmental standards for safe usage

Low halo compliance ensures eco friendly performance in sensitive applications

Voltage rating of 500V allows for versatile operational environments

Vertical orientation promotes ease of integration and alignment during assembly

Wide operating temperature range enhances reliability across various conditions

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