Molex 216571 Series Vertical Through Hole PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Subtotaal (1 tray van 120 eenheden)*

€ 227,88

(excl. BTW)

€ 275,73

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Tijdelijk niet op voorraad
  • Verzending vanaf 19 januari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tray(s)
Per tray
Per stuk*
1 +€ 227,88€ 1,899

*prijsindicatie

RS-stocknr.:
684-828
Fabrikantnummer:
216571-3003
Fabrikant:
Molex
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

Molex

Series

216571

Product Type

PCB Header

Pitch

3mm

Number of Contacts

3

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Row Pitch

3mm

Standards/Approvals

RoHS

Land van herkomst:
CN
The Molex Micro-Fit+ Vertical Header designed to facilitate efficient power and signal connections within various electronic applications. This robust header, with a 3.00mm pitch and three circuits, ensures reliable performance in demanding environments, thanks to its glow-wire capability. Constructed from high copper alloy and featuring a matte tin plated termination, it combines durability with excellent electrical characteristics. Operating over a temperature range of -40° to +125°C, this component is ideal for long-lasting connections. Its one-row design enhances space optimisation on PCBs, while features like PCB retention and compatibility with standard housings make it an essential choice for users aiming for reliability and efficiency in their wire-to-board connections.

Glow wire capable for enhanced safety in structural applications

Designed with a vertical orientation for compact PCB layouts

Robust one row, three circuit design maximises space efficiency

Constructed with high copper alloy for superior conductivity

Matte tin plating for improved solderability and corrosion resistance

Durability rating of 200 mating cycles ensures long term reliability

Utilises lead free solder process capability for eco friendly manufacturing

Locking features to mating parts enhance connection stability

Gerelateerde Links