Molex 2599 Series Vertical PCB PCB Header, 7 Contact(s), 5.08 mm Pitch, 1 Row, Shrouded

Subtotaal (1 zak van 250 eenheden)*

€ 216,26

(excl. BTW)

€ 261,67

(incl. BTW)

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  • Verzending vanaf 19 januari 2026
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Per Zak
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1 +€ 216,26€ 0,865

*prijsindicatie

RS-stocknr.:
684-796
Fabrikantnummer:
10-08-5071
Fabrikant:
Molex
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Merk

Molex

Series

2599

Product Type

PCB Header

Pitch

5.08mm

Current

7A

Number of Contacts

7

Housing Material

Nylon

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

PCB

Contact Plating

Tin

Contact Material

Brass

Termination Type

Solder

Row Pitch

5.08mm

Tail Pin Length

4.45mm

Standards/Approvals

RoHS

Voltage

250 V

Land van herkomst:
IN
The Molex KK Header, Vertical, with Polarizing Backwall, is engineered to facilitate reliable wire-to-board connections in diverse electronic applications. With its robust design featuring 7 circuits and tin plating, this component is crafted to ensure durable performance and secure connectivity, making it an essential choice for PCB headers and receptacles. Designed with the user in mind, it supports a maximum current of 7.0A and a voltage of 250V, ensuring capabilities suited for various power applications. The header's compatibility with multiple housings and connectors offers flexible integration opportunities within various electronic systems, enhancing both functionality and ease of assembly.

Active product status guarantees availability for immediate use

Versatile application for power and wire to board connections

Compact design with a vertical orientation suitable for space constrained PCB layouts

Durability ensured with 25 mating cycles, enhancing longevity

Natural resin colour for a discreet yet professional appearance

No breakaway feature aligns with secure mounting requirements

Meets UL certification standards, promising safety and dependability

Low hazard materials support compliance with environmental regulations

Efficient through hole termination interface style simplifies installation

Stackable design optimises space and improves circuit density

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