Phoenix Contact DMC Series Wave Soldering Mount PCB Header, 28 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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€ 1.763,93

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€ 2.134,36

(incl. BTW)

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  • Verzending vanaf 02 maart 2026
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RS-stocknr.:
558-735
Fabrikantnummer:
1844840
Fabrikant:
Phoenix Contact
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Merk

Phoenix Contact

Series

DMC

Product Type

PCB Header

Current

6A

Pitch

2.54mm

Number of Contacts

28

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON DFMC 0.5

Mount Type

Wave Soldering Mount

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

100°C

Contact Gender

Male

Tail Pin Length

2mm

Standards/Approvals

CHINA RoHS, cULus, DIN 50018:2013-05, DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07, EU REACH SVHC, EU RoHS, IEC 60068-2-70:1995-12, IEC 60512-1-1:2002-02, IEC 60512-1-2:2002-02, IEC 60512-13-5:2006-02, IEC 60512-15-1:2008-05, IEC 60512-3-1:2002-02, IEC 60512-5-1:2002-02, IEC 60664-1:2007-04, VDE

Voltage

160 V

Land van herkomst:
PL
The Phoenix Contact PCB header is engineered for optimal connectivity in electronic applications, featuring a robust design suited for through-hole reflow soldering. With a versatile array of connections, this product caters efficiently to various circuit designs, ensuring reliable performance. The connectors boast gold-plated contacts, which enhance signal stability and durability, making them ideal for long-term use. Its compact structure allows for efficient integration within small spaces while maintaining a high contact density across multiple layers. Designed with user convenience in mind, this component is not only compliant with stringent environmental regulations but also simplifies the assembly process, contributing to an efficient production workflow.

Meets stringent environmental standards for safe usage

Optimised for automated assembly and through-hole applications

Designed to withstand rigorous reflow and wave soldering processes

Features a compact layout, enhancing circuit design flexibility

Robust gold-plated contacts guarantee longevity and reliability

Allows for a high density of connections in limited spaces

Provides exceptional electrical performance with low contact resistance

Comes in packaging units promoting easy handling and organisation

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