Phoenix Contact MCDN Series Solder PCB Header, 18 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 557-507
- Fabrikantnummer:
- 1953787
- Fabrikant:
- Phoenix Contact
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- RS-stocknr.:
- 557-507
- Fabrikantnummer:
- 1953787
- Fabrikant:
- Phoenix Contact
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
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Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Phoenix Contact | |
| Product Type | PCB Header | |
| Series | MCDN | |
| Current | 8A | |
| Pitch | 3.5mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 18 | |
| Number of Rows | 2 | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Solder | |
| Connector System | COMBICON FMC 1.5 MCDN 1.5 | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin Plated | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 3.5mm | |
| Maximum Operating Temperature | 100°C | |
| Tail Pin Length | 2.6mm | |
| Contact Gender | Male | |
| Mating Pin Length | 2.6mm | |
| Standards/Approvals | cULus Recognised Approval ID: E60425-20110128, VDE Approval ID: 40011723 | |
| Voltage | 160 V | |
| Alles selecteren | ||
|---|---|---|
Merk Phoenix Contact | ||
Product Type PCB Header | ||
Series MCDN | ||
Current 8A | ||
Pitch 3.5mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 18 | ||
Number of Rows 2 | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Solder | ||
Connector System COMBICON FMC 1.5 MCDN 1.5 | ||
Contact Material Copper Alloy | ||
Contact Plating Tin Plated | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 3.5mm | ||
Maximum Operating Temperature 100°C | ||
Tail Pin Length 2.6mm | ||
Contact Gender Male | ||
Mating Pin Length 2.6mm | ||
Standards/Approvals cULus Recognised Approval ID: E60425-20110128, VDE Approval ID: 40011723 | ||
Voltage 160 V | ||
- Land van herkomst:
- DE
The Phoenix Contact PCB Header is part of the COMBICON Connectors S product line and is suitable for through-hole reflow. The mounting type supports both THR soldering and wave soldering. The pin layout is linear pinning, with contacts MADE from copper alloy. The surface is tin-plated, and the insulating material is LCP (Liquid Crystal Polymer).
Designed for integration into the SMT soldering process
Vertical connection enables multi row arrangement on the PCB
Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density
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