Phoenix Contact MCDNV Series Solder PCB Header, 18 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 557-126
- Fabrikantnummer:
- 1952856
- Fabrikant:
- Phoenix Contact
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- RS-stocknr.:
- 557-126
- Fabrikantnummer:
- 1952856
- Fabrikant:
- Phoenix Contact
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Phoenix Contact | |
| Series | MCDNV | |
| Product Type | PCB Header | |
| Pitch | 3.5mm | |
| Current | 8A | |
| Number of Contacts | 18 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Solder | |
| Connector System | COMBICON FMC 1.5 MCDN 1.5 | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 3.5mm | |
| Termination Type | Solder | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 100°C | |
| Tail Pin Length | 2.6mm | |
| Standards/Approvals | cULus Recognised, VDE | |
| Mating Pin Length | 26mm | |
| Voltage | 160 V | |
| Alles selecteren | ||
|---|---|---|
Merk Phoenix Contact | ||
Series MCDNV | ||
Product Type PCB Header | ||
Pitch 3.5mm | ||
Current 8A | ||
Number of Contacts 18 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Solder | ||
Connector System COMBICON FMC 1.5 MCDN 1.5 | ||
Contact Material Copper Alloy | ||
Contact Plating Tin | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 3.5mm | ||
Termination Type Solder | ||
Contact Gender Male | ||
Maximum Operating Temperature 100°C | ||
Tail Pin Length 2.6mm | ||
Standards/Approvals cULus Recognised, VDE | ||
Mating Pin Length 26mm | ||
Voltage 160 V | ||
- Land van herkomst:
- DE
The Phoenix Contact PCB Header is part of the COMBICON Connectors S product line and is suitable for through-hole reflow. The mounting type supports both THR soldering and wave soldering. The pin layout is linear pinning, with contacts MADE from copper alloy. The surface is tin-plated, and the insulating material is LCP (Liquid Crystal Polymer).
Designed for integration into the SMT soldering process
Vertical connection enables multi row arrangement on the PCB
Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density
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