Molex 21657 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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€ 10,96

(excl. BTW)

€ 13,26

(incl. BTW)

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  • Plus verzending 240 stuk(s) vanaf 15 december 2025
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1 - 4€ 10,96€ 2,192
5 - 9€ 10,08€ 2,016
10 +€ 9,10€ 1,82

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RS-stocknr.:
536-865
Fabrikantnummer:
2165711024
Fabrikant:
Molex
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Merk

Molex

Series

21657

Product Type

PCB Header

Pitch

3mm

Current

13A

Housing Material

Liquid Crystal Polymer

Number of Contacts

4

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Power, Wire-to-Board

Contact Material

High Copper Alloy

Contact Plating

Matt Tin

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3mm

Tail Pin Length

3.18mm

Contact Gender

Female

Maximum Operating Temperature

125°C

Standards/Approvals

No

Voltage

600 Vrms

Land van herkomst:
CN
The Molex Micro fit+ versa Color is a high performance vertical header, designed specifically for reliable wire to board applications. Its thoughtful engineering ensures a secure connection in environments where performance stability is paramount. With a compact 3.00mm pitch and a robust 4 circuit design, this product excels in efficiency and durability. The matte tin plating enhances electrical performance while the glow wire capability offers added safety. Whether in consumer electronics or industrial settings, this product promises seamless integration and dependable functionality, catering beautifully to today’s advanced connectivity needs.

High maximum current rating ensures robust performance across various applications

Unique glow wire capability enhances safety in demanding environments

Constructed from high copper alloy for superior conductivity and reliability

Designed for easy orientation and secure lock with mating parts

Low halogen status contributes to environmental compliance and safety standards

Flexible PCB retention and thickness recommendations cater to varied design requirements

Single row design optimises space on circuit boards while maintaining efficiency

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