Phoenix Contact MCV Series Straight Through Hole PCB Header, 17 Contact(s), 3.81 mm Pitch, 1 Row, Shrouded

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€ 573,00

(excl. BTW)

€ 693,33

(incl. BTW)

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  • Verzending vanaf 23 februari 2026
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RS-stocknr.:
520-978
Fabrikantnummer:
1829014
Fabrikant:
Phoenix Contact
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Merk

Phoenix Contact

Product Type

PCB Header

Series

MCV

Current

8A

Pitch

3.81mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

17

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

COMBICON MC 1.5

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Row Pitch

3.81mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

100°C

Tail Pin Length

2mm

Contact Gender

Male

Mating Pin Length

2mm

Standards/Approvals

cULus Recognised, VDE approval of drawings

Voltage

160 V

Land van herkomst:
DE
The Phoenix Contact innovative PCB header offers unmatched versatility for modern electronics design, blending robust performance with sophisticated design elements. Tailored specifically for through-hole reflow applications, the product promises seamless integration into surface-mount technology soldering processes, ensuring reliable connectivity in compact electronic systems. With a focus on mechanical stability, the header features a screwable flange that enhances its resilience, making it ideal for demanding environments. Its linear pinning layout and compact dimensions allow for efficient use of space on PCBs, accommodating diverse connector technologies without compromising on design flexibility. Backed by comprehensive approvals and adherence to international standards, this product is engineered to meet high performance and safety criteria, catering to the needs of engineers and designers alike.

Designed to facilitate integration into surface-mount soldering processes

Screwable flange guarantees superior mechanical stability

Vertical connection capability supports multi-row arrangements on PCBs

Accommodates various connection technologies for maximum design flexibility

Weight-efficient design enables cost-effective shipping and handling

Complies with rigorous international standards, ensuring reliability and safety

Solderable using reflow processes, enhancing manufacturing efficiency

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