Phoenix Contact IC Series Wave Soldering Mount PCB Header, 21 Contact(s), 5.08 mm Pitch, 1 Row, Shrouded

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We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
RS-stocknr.:
520-300
Fabrikantnummer:
1786598
Fabrikant:
Phoenix Contact
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Merk

Phoenix Contact

Product Type

PCB Header

Series

IC

Current

12A

Pitch

5.08mm

Number of Contacts

21

Housing Material

Polyamide

Number of Rows

1

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON MSTB 2.5

Mount Type

Wave Soldering Mount

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Row Pitch

5.08mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Contact Gender

Female

Tail Pin Length

3.5mm

Maximum Operating Temperature

100°C

Mating Pin Length

3.5mm

Standards/Approvals

No

Land van herkomst:
DE
The Phoenix Contact IC 2.5/21-G-5.08 PCB header is designed to offer exceptional versatility in device connection design. This innovative solution features a compact structure that is ideal for a variety of applications requiring reliable and secure connections. The inverted header allows for touch-proof device outputs, enhancing safety while maintaining a straightforward PCB replacement process through plug-in modules. A robust construction ensures it withstands demanding environments, while its compatibility with different connection technologies makes it a go-to choice for engineers seeking flexibility and efficiency. Whether it’s for industrial automation or general electronic connections, this PCB header is engineered to meet diverse connectivity needs with ease.

Compact design optimises PCB space efficiency

Inverted header style enhances safety through touch-proof connections

Compatible with multiple connection technologies for flexible use

Enables simple module exchange, facilitating quick maintenance

Robust housing material ensures longevity and reliability

Designed for wave soldering, simplifying mount processes

Environmentally friendly, complying with RoHS regulations

Lightweight structure improves overall assembly efficiency

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