Molex 171856 Series Vertical Through Hole PCB Header, 6 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

Subtotaal (1 rol van 150 eenheden)*

€ 269,50

(excl. BTW)

€ 326,10

(incl. BTW)

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  • Verzending vanaf 04 augustus 2026
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RS-stocknr.:
507-451
Fabrikantnummer:
171856-3006
Fabrikant:
Molex
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Merk

Molex

Product Type

PCB Header

Series

171856

Pitch

2.54mm

Current

4A

Housing Material

High Temperature Thermoplastic

Number of Contacts

6

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Matt Tin

Row Pitch

2.54mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

2.34mm

Standards/Approvals

94V-1, chemSHERPA, EU RoHS, IEC 61249-2-21, IEC-62474, IPC 1752A Class C, IPC 1752A Class D, REACH SVHC, UL E29179

Mating Pin Length

12.95mm

Voltage

50 V

Distrelec Product Id

304-53-184

Land van herkomst:
IN
The TE Connectivity innovative connector is designed to provide reliable electrical connections in various applications. The 2.54mm pitch KK 254 RPC vertical header features a robust friction lock mechanism, ensuring a secure fit even under demanding conditions. With tin plating that enhances conductivity and resistance to corrosion, this component guarantees efficient signal transmission. Engineered for versatility, it accommodates six circuits and is suitable for board-to-board, power, and signal connections. The product's thoughtful design includes a compact form factor and vertical orientation, making it ideal for space-constrained environments. Enhanced with high-temperature thermoplastic resin, it maintains performance across a wide temperature range, ensuring adaptability to various operational requirements.

Vertical orientation optimizes space in compact designs

Friction lock mechanism enhances connection stability

Tin plating improves conductivity and corrosion resistance

High-temperature thermoplastic resin ensures durability

Supports both power and signal applications seamlessly

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