TE Connectivity AMPMODU Series Vertical Board PCB Header, 80 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

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Subtotaal (1 tube van 9 eenheden)*

€ 264,85

(excl. BTW)

€ 320,47

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 264,85€ 29,428

*prijsindicatie

RS-stocknr.:
504-592
Fabrikantnummer:
1-104068-6
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

1.27mm

Current

3.6A

Housing Material

Liquid Crystal Polymer

Number of Contacts

80

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Tail Pin Length

2.54mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA, CSA LR7189, UL, UL 94V-0, UL E28476

Voltage

30 V

Distrelec Product Id

304-53-357

Land van herkomst:
US
The TE Connectivity PCB Mount Header is a cutting-edge component designed for vertical board-to-board connections, ensuring a robust and reliable interface in electronic applications. With a sleek 80-position configuration and a compact 1.27 mm centreline pitch, it is engineered for optimal space efficiency without compromising performance. Fully shrouded for enhanced protection, this connector is detailed with gold plating to ensure excellent conductivity and durability. Operating with an impressive voltage of up to 30 VAC, it is built to withstand various environmental conditions, making it an ideal choice for demanding applications. The header is compatible with wave soldering processes, further enhancing its adaptability in assembly lines. With a temperature range that ensures reliability even in extreme conditions, this product stands as a testament to quality and innovation in connection technology.

Designed for board to board applications ensuring reliable connections

Fully shrouded header provides additional protection against mechanical damage

High quality gold plating guarantees superior conductivity

Simple integration with wave solder processes enhances assembly efficiency

Mating retention feature ensures secure connections

LCP housing material offers excellent thermal and electrical performance

Certifications for compliance with various industry standards enhance reliability

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