TE Connectivity AMPMODU Series Vertical Board PCB Header, 54 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

Subtotaal (1 tube van 32 eenheden)*

€ 239,76

(excl. BTW)

€ 290,11

(incl. BTW)

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  • Klaar voor verzending vanaf 20 juli 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 239,76€ 7,493

*prijsindicatie

RS-stocknr.:
504-216
Artikelnummer Distrelec:
304-53-833
Fabrikantnummer:
2-535542-7
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Housing Material

Fibreglass Polyester

Number of Contacts

54

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

2.54mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Tail Pin Length

3.3mm

Maximum Operating Temperature

125°C

Contact Gender

Female

Standards/Approvals

CSA LR7189, UL E28476

Voltage

333V

Niet conform

Land van herkomst:
CN
The TE Connectivity PCB Mount Receptacle is designed for seamless integration in board-to-board applications, ensuring a reliable connection with its 54 positions arranged in a vertical orientation. Crafted from high-quality materials, this connector supports efficient soldering through its dedicated through-hole method, making installation straightforward and efficient. The high-performance gold plating enhances electrical conductivity while reducing wear over time. Ideal for use in demanding environments, this receptacle maintains its reliability across a wide operating temperature range, ensuring consistent performance for your electronic needs. Its innovative design includes a low connector profile and is stackable, providing flexibility and space-saving solutions in your design. Whether you’re assembling new technology or upgrading existing systems, this product is built to meet the rigorous demands of modern electronics.

Features 54 positions for robust connectivity

Vertical PCB mount orientation accommodates space constraints

Gold plating ensures superior conductivity and durability

Capable of withstanding high operating voltages for reliable performance

Compatible with board to board configurations for versatile applications

Designed for easy integration into complex electronic systems

Offers high insulation resistance to protect against electrical issues

Supports wave solder processes for efficient production

Made from sturdy materials to withstand environmental stress

No sealing required simplifying installation and maintenance

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