TE Connectivity AMP Series Vertical Board PCB Header, 2 Contact(s), 2.5 mm Pitch, 1 Row, Shrouded

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€ 207,59

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€ 251,18

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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RS-stocknr.:
503-963
Fabrikantnummer:
1376478-2
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMP

Product Type

PCB Header

Pitch

2.5mm

Current

2.5A

Number of Contacts

2

Housing Material

Polyamide 66 Fibreglass

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Plated

Contact Material

Brass

Minimum Operating Temperature

30°C

Termination Type

Solder

Row Pitch

2.5mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Tail Pin Length

3.2mm

Mating Pin Length

4.35mm

Standards/Approvals

2016 Compliant, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant

Voltage

50 V

Distrelec Product Id

304-63-924

Land van herkomst:
CN
The TE Connectivity PCB Mount Header is engineered specifically for vertical wire-to-board connections, offering a reliable solution for two-position applications. Designed with a fully shrouded interface, it ensures secure mating while safeguarding against accidental disconnections. With a compact 2.5 mm centreline, this connector not only optimises space but also facilitates efficient PCB layout designs. The durable housing material enhances longevity and performance under varying conditions. This product stands out with its active status, providing confidence in its availability for modern electronic designs.

Ensures secure and stable connections in compact spaces

Constructed with natural nylon 66 GF for enhanced durability

Features a unique latch mechanism for mating retention

Appropriate for a range of operating temperatures from -30 to 105 °C

Utilises copper for superior electrical conductivity in contacts

Designed with a matte finish plating to reduce friction during mating

Provides an efficient through-hole solder termination method

Supports wave solder processes up to 265°C

Enables a compliant design with multiple directives for ecological safety

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