TE Connectivity Fortis Zd Series Right Angle Panel PCB Header, 180 Contact(s), 0.08 mm Pitch, 9 Row, Shrouded

Bekijk alle PCB Headers

Subtotaal (1 tube van 11 eenheden)*

€ 4.118,08

(excl. BTW)

€ 4.982,88

(incl. BTW)

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  • Verzending vanaf 23 februari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 4.118,08€ 374,371

*prijsindicatie

RS-stocknr.:
501-760
Artikelnummer Distrelec:
304-49-626
Fabrikantnummer:
2102247-2
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

Fortis Zd

Current

1.5A

Pitch

0.08mm

Number of Contacts

180

Number of Rows

9

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Panel

Connector System

Board-to-Board

Minimum Operating Temperature

65°C

Row Pitch

0.08mm

Maximum Operating Temperature

125°C

Standards/Approvals

2016 No Restricted Materials Above Threshold, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant

Land van herkomst:
US
The TE Connectivity High-speed backplane connector offers cutting-edge connectivity solutions for intricate electronic systems. Designed with nine rows and twenty columns, it provides a robust interface for PCB mounting, ensuring secure connections even in high-density applications. The fully shrouded right-angle header facilitates efficient space utilisation while protecting against accidental disconnections. Built to withstand a wide operating temperature range, this connector is optimal for diverse environments, promoting reliability in all conditions. Its lightweight construction combined with low contact current rating makes it a perfect fit for modern electronics, where precision and performance are paramount. The product embodies a symbiosis of advanced engineering and practical application, marked to enhance the efficiency of your electronic assemblies.

Provides reliable signal integrity for demanding applications

Compact design promotes maximum utilisation of space in electronic layouts

Fully shrouded for enhanced protection against environmental factors

Compatible with both traditional and advanced backplane architectures

Facilitates efficient thermal management due to its unique design

Offers versatility in various electronic assemblies and configurations

Optimal for high-density arrangements in complex circuits

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