TE Connectivity AMPMODU Series Vertical Board PCB Header, 6 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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€ 259,66

(excl. BTW)

€ 314,19

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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RS-stocknr.:
479-476
Fabrikantnummer:
1825514-4
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Housing Material

Thermoplastic

Number of Contacts

6

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Plated

Contact Material

Brass

Termination Type

Surface Mount

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Distrelec Product Id

304-53-723

Land van herkomst:
MX
The TE Connectivity PCB mount header embodies the pinnacle of wire-to-board connectivity, designed for modern electronics. This vertical connector supports six positions with a convenient 2.54 mm centreline, ensuring seamless integration within compact PCBs. Fully shrouded for enhanced safety and reliability, it’s ideal for applications that demand high performance in signal processing. Crafted from robust thermoplastic, the housing withstands a broad operating temperature range of -65 to 105 °C, making it suitable for various environments. The innovative design features a square contact layout and latching for secure mating, ensuring stability during operation. With a tin-plated contact area, this component also promotes excellent electrical conductivity, making it a trustworthy choice for your projects.

Designed for vertical PCB mounting, optimising space utilisation

Fully shrouded design enhances electrical safety during usage

Accommodates six positions, offering versatile connection options

Tin-plated contact areas ensure superior conductivity and durability

Thermoplastic housing guarantees resilience against varied temperatures

Latch feature facilitates secure mating, preventing accidental disconnections

Compact dimensions cater to space-constrained applications

Compatible with a wide range of connector assemblies, enhancing system design flexibility

Ideal for signal applications, boosting performance in electronic configurations

Designed for reflow solder processes, streamlining assembly operations

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