TE Connectivity 5316135 Series Board PCB Header, 0.6 mm Pitch, Unshrouded

Subtotaal (1 tray van 50 eenheden)*

€ 234,89

(excl. BTW)

€ 284,22

(incl. BTW)

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  • Verzending vanaf 26 januari 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 234,89€ 4,698

*prijsindicatie

RS-stocknr.:
478-166
Fabrikantnummer:
5316135-3
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

5316135

Pitch

0.6mm

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Contact Plating

Tin

Termination Type

Solder

Row Pitch

0.6mm

Maximum Operating Temperature

260°C

Standards/Approvals

2016 No Restricted Materials Above Threshold, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Out of Scope, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant

Distrelec Product Id

304-65-299

Land van herkomst:
CN
The TE Connectivity Refined board-to-board connector embodies the perfect synergy of precision and reliability for advanced electronic applications. Designed with a free height of 0.6mm, it ensures optimal stacking performance while maintaining excellent solder process capabilities, withstanding temperatures of up to 260°C. The intelligent design makes it compatible with a range of high-speed applications, allowing for confident integration into various devices. With its low halogen content and compliance with stringent EU regulations, this connector not only guarantees superior functionality but also reinforces commitments to environmental responsibility. Its durable construction and robust specifications contribute to enhanced longevity and performance across diverse operational conditions, making it an ideal choice for engineers seeking dependable connectivity solutions.

Offers a free height measurement to accommodate diverse assembly needs

Complies with EU RoHS and ELV directives for responsible sourcing

Low halogen formulation promotes environmentally-friendly use

Solder process capability supports advanced manufacturing techniques

Versatile design suited for a range of board-to-board applications

Maintains high-performance standards while ensuring efficient space utilisation

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