TE Connectivity Z-PACK Series Vertical Board PCB Header, 125 Contact(s), 2 mm Pitch, 5 Row, Unshrouded

Bekijk alle PCB Headers

Subtotaal (1 verpakking van 20 eenheden)*

€ 246,97

(excl. BTW)

€ 298,83

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Tijdelijk niet op voorraad
  • Verzending vanaf 20 januari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en)
Per verpakking
Per stuk*
1 +€ 246,97€ 12,349

*prijsindicatie

RS-stocknr.:
478-085
Fabrikantnummer:
5100141-4
Fabrikant:
TE Connectivity
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

TE Connectivity

Series

Z-PACK

Product Type

PCB Header

Pitch

2mm

Current

1.5A

Housing Material

Fibreglass Reinforced Polybutylene Terephthalate

Number of Contacts

125

Number of Rows

5

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Solder

Row Pitch

2mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

125°C

Tail Pin Length

3.7mm

Contact Gender

Male

Standards/Approvals

2016, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, EU RoHS 2011/65/EU

Distrelec Product Id

304-49-997

Land van herkomst:
CN
The TE Connectivity hard metric backplane PCB mount header is designed to accommodate data rates of up to 1 Gb/s, making it an ideal choice for high-performance computing applications. With a robust construction featuring 25 columns and 5 rows, this connector supports a total of 125 positions, ensuring reliable signal integrity and efficient data transmission. The vertical design optimises space and simplifies board layout for modern electronic systems, while the grey housing provides a neutral aesthetic. This component is perfect for mezzanine configurations, guaranteeing a seamless interface between boards. Engineered from durable PBT GF material, it withstands extreme operating conditions ranging from -55 to 125 °C, establishing itself as a reliable solution for various environmental settings. Compatible with a range of TE’s Z-PACK connectors, it is tailored for those seeking quality and durability in their electronic connections.

Constructed for high-speed applications, supporting data rates up to 1 Gb/s

Designed with a total of 125 positions for flexible connectivity

Compatible with mezzanine architectures, optimising dense circuit board designs

Made from durable materials that resist thermal and physical stresses

Features an easy-to-use through-hole press-fit termination method

Available in a vertical mount orientation to enhance PCB layout efficiency

Engineered to comply with EU RoHS and ELV directives, ensuring environmental safety

Offers a dependable connection with a nickel underplating and gold plating for excellent conductivity

Gerelateerde Links