TE Connectivity MTA-100 Series Right Angle Board PCB Header, 2 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

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€ 276,50

(excl. BTW)

€ 334,56

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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RS-stocknr.:
477-191
Fabrikantnummer:
3-644694-2
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

MTA-100

Product Type

PCB Header

Pitch

2.54mm

Current

5A

Housing Material

Fibreglass Polyester

Number of Contacts

2

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Unshrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Termination Type

Solder

Minimum Operating Temperature

-55°C

Row Pitch

2.54mm

Tail Pin Length

2.79mm

Maximum Operating Temperature

105°C

Mating Pin Length

6.6mm

Standards/Approvals

RoHS

Voltage

250 V

Distrelec Product Id

304-54-053

Land van herkomst:
CN
The TE Connectivity PCB Mount Header offers a versatile solution for wire-to-board connections, specifically designed with a right angle orientation and a breakaway feature to optimise space and ease of use. With its 2-position configuration and a compact 2.54 mm pitch, this connector seamlessly integrates into a variety of applications. Crafted using high-quality materials, it ensures durability and reliability in demanding environments. Notably, its operational voltage rating of 250 VAC enhances its efficiency in handling substantial electrical loads. This product caters to signalling circuits, making it an excellent choice for a multitude of industries, including telecommunications and consumer electronics.

Designed for high-performance wire-to-board applications

Optimises PCB real estate with a compact right angle layout

Breakaway capability allows for flexible assembly and connections

Constructed from robust polyester material for long-lasting use

Provides excellent electrical performance across varied conditions

Compatible with industry standards for seamless integration

High-temperature resilience ensures reliability under demanding conditions

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