TE Connectivity AMPMODU Series Vertical Board PCB Header, 10 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

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Subtotal (1 reel of 250 units)*

€ 426,17

(exc. VAT)

€ 515,67

(inc. VAT)

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  • Verzending vanaf 22 januari 2026
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Reel(s)
Per Reel
Per unit*
1 +€ 426,17€ 1,705

*price indicative

RS Stock No.:
473-352
Mfr. Part No.:
5-147377-1
Brand:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

1.27mm

Current

1A

Housing Material

Polyphthalamide

Number of Contacts

10

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board, Wire-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

1.27mm

Termination Type

Surface Mount

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Distrelec Product Id

304-54-176

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is engineered for superior performance in board-to-board and wire-to-board applications. This fully shrouded connector features a vertical mount orientation and offers 10 positions with a compact 1.27 mm centreline spacing. Designed to ensure reliable electrical connections, it boasts durability and is perfect for applications requiring enhanced signal integrity. With a robust construction that includes gold-plated contacts for optimal conductivity, this connector is ideal for power and signal circuit applications. It meets strict compliance standards, making it a trustworthy choice for demanding environments. Whether you're developing consumer electronics or industrial machinery, this connector enhances connectivity solutions with its advanced features.

Offers a fully shrouded design for enhanced protection against environmental factors

Utilises gold plating on mating areas to ensure excellent conductivity

Professionally engineered for maximum electrical and mechanical reliability

Supports vertical PCB mount orientation, facilitating space-efficient designs

Compatible with standard solder processes, streamlining assembly

Resistant to high temperatures, suited for various operational environments

Designed with latching mechanisms for secure mating and alignment

Backed by compliance with industry standards, ensuring top quality

Flexible use in both power and signal applications, enhancing versatility

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