TE Connectivity MATE-N-LOK Series Vertical Board PCB Header, 3 Contact(s), 4.14 mm Pitch, 1 Row, Shrouded

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€ 205,25

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€ 248,35

(incl. BTW)

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  • Verzending vanaf 15 juni 2026
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RS-stocknr.:
472-946
Fabrikantnummer:
1-770873-1
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

MATE-N-LOK

Pitch

4.14mm

Current

9.5A

Number of Contacts

3

Housing Material

Nylon

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

-55°C

Row Pitch

4.14mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.69mm

Contact Gender

Male

Standards/Approvals

RoHS

Voltage

600 V

Distrelec Product Id

304-58-037

Land van herkomst:
US
The TE Connectivity PCB Mount Header is expertly designed for vertical wire-to-board connections, featuring a compact 3-position layout with a 4.14 mm centreline. This fully shrouded connector is crafted from high-quality materials, ensuring durability and reliability in demanding applications. Equipped with gold-plated contacts, it provides enhanced conductivity and corrosion resistance, making it ideal for use in various electronic systems. Its straightforward through-hole solder termination method ensures secure and stable mounting on printed circuit boards, while the optimal design supports efficient assembly processes. The connector's alignment features simplify integration within complex systems, catering to a wide range of industrial and commercial uses.

Constructed with a robust nylon housing for added longevity

Utilises a locking tab mechanism to ensure secure mating

Offers superior electrical performance and operational efficiency

Designed for ease of use with chamfered edges for accurate alignment

Complies with multiple industry standards for electrical safety

Provides excellent mating retention to withstand vibrations and movement

Features a compact design, optimising space within electronic assemblies

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