TE Connectivity MTA-156 Series Vertical Board PCB Header, 14 Contact(s), 3.96 mm Pitch, 1 Row, Shrouded

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€ 249,74

(excl. BTW)

€ 302,19

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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RS-stocknr.:
472-829
Fabrikantnummer:
1-640445-4
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

MTA-156

Product Type

PCB Header

Pitch

3.96mm

Current

14.24A

Number of Contacts

14

Housing Material

Fibreglass Thermoplastic Polyester

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Minimum Operating Temperature

-55°C

Row Pitch

3.96mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.18mm

Mating Pin Length

10.16mm

Standards/Approvals

CSA, UL, VDE

Voltage

60 V

Distrelec Product Id

304-50-124

Land van herkomst:
CN
The TE Connectivity PCB Mount Header is engineered for vertical wire-to-board applications, specifically designed to accommodate 14 positions on a 3.96 mm centreline. This robust component features a partially shrouded header type that ensures secure connections for electronic circuits. With a through-hole solder termination method, the header provides exceptional reliability and performance in various operating conditions. Its construction from thermoplastic polyester gives it an impressive heat tolerance, making it suitable for high-temperature environments. The product's versatility in electrical applications simplifies the integration into different circuit designs, helping to enhance efficiency in assemblies.

Designed for effective vertical mounting in intricate PCB setups

Utilises a natural finish to blend seamlessly with standard circuit boards

Delivers improved resistance with a tin-plated finish for enhanced durability

Facilitates easy alignment during assembly through its friction lock mechanism

Compatible with a wide range of TE products for increased versatility

Meets stringent industry standards, ensuring reliability in various applications

Optimised for high-performance conditions, extending its operational lifespan

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