Molex 50238 Series Vertical PCB Base Strip, 5 Contact(s), 1.25 mm Pitch, 1 Row

Subtotaal (1 rol van 1400 eenheden)*

€ 666,00

(excl. BTW)

€ 805,86

(incl. BTW)

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  • Verzending vanaf 23 februari 2026
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RS-stocknr.:
472-019
Artikelnummer Distrelec:
304-56-434
Fabrikantnummer:
502382-0570
Fabrikant:
Molex
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Merk

Molex

Series

50238

Product Type

Base Strip

Current

1A

Pitch

1.25mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

5

Number of Rows

1

Orientation

Vertical

Connector System

Wire-to-Board

Mount Type

PCB

Contact Plating

Tin

Contact Material

Copper Alloy

Termination Type

Surface Mount

Row Pitch

1.25mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Standards/Approvals

EU RoHS, IEC-62474, IPC 1752A Class C, IPC 1752A Class D, UL E29179

Voltage

5 V

Land van herkomst:
MY
The TE Connectivity Wire to board connector stands out due to its single-row vertical configuration, which ensures efficient space management on PCBs. Engineered for durability, the receptacle features a robust tin plating that enhances both performance and longevity. With a maximum current rating of 1.0A and a voltage capacity of up to 50V AC/DC, it is fully equipped to handle various signalling applications while maintaining compliance with industry standards. Additionally, its high-temperature thermoplastic construction makes it suitable for a wide operating temperature range, providing versatility in diverse environments. Designed with meticulous attention to the mating mechanism, this product guarantees a secure connection, making it an ideal choice for electronic manufacturers seeking quality and efficiency.

Designed for space-efficient PCB configurations

Robust tin plating enhances both performance and longevity

Supports a wide range of signalling applications effectively

Constructed from high-temperature thermoplastic for versatility

Ensures secure connections with precise keying mechanisms

Durability tested for up to 30 mating cycles, ensuring reliability

Optimally structured to facilitate surface mount technology

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