Molex 505568 Series Vertical Surface PCB Header, 9 Contact(s), 1.25 mm Pitch, 1 Row, Shrouded

Subtotaal (1 rol van 1200 eenheden)*

€ 1.141,73

(excl. BTW)

€ 1.381,49

(incl. BTW)

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  • Verzending vanaf 20 januari 2026
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RS-stocknr.:
471-958
Fabrikantnummer:
505568-0971
Fabrikant:
Molex
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Merk

Molex

Series

505568

Product Type

PCB Header

Pitch

1.25mm

Current

1.5A

Housing Material

Polyamide

Number of Contacts

9

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin Bismuth

Termination Type

Surface Mount

Row Pitch

1.25mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Standards/Approvals

IEC 61249-2-21, IEC-62474, IPC 1752A Class C, IPC 1752A Class D, UL E29179

Voltage

50 Vrms

Distrelec Product Id

304-57-352

Land van herkomst:
MY
The TE Connectivity plus PCB header is designed for reliability and performance in a compact form factor. With a pitch of just 1.25mm, this innovative product enables efficient space utilisation on PCBs while delivering robust signal integrity. It features a vertical orientation and is suited for surface mount applications, ensuring ease of integration in various designs. Enhanced with tin-bismuth plating, this header not only fosters strong electrical connections but also contributes to environmental compliance. Its construction allows for effective pick-and-place handling, making it an ideal choice for modern manufacturing processes that demand precision and high-throughput efficiency. Furthermore, this product is built to withstand multiple mating cycles, making it an exceptional solution for demanding applications.

Designed for surface mount applications for ease of use

Compact 1.25mm pitch optimises space efficiency on PCBs

Durable construction supports extensive mating cycles

Vertical orientation enhances versatility in various designs

Tin-bismuth plating ensures reliable electrical connectivity

Robust design compliant with environmental standards

Facilitates automated assembly for streamlined production

Effective for signal and wire-to-board applications

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