TE Connectivity AMPMODU Series Right Angle Board PCB Header, 10 Contact(s), 1.25 mm Pitch, 1 Row

Subtotaal (1 tray van 200 eenheden)*

€ 206,22

(excl. BTW)

€ 249,53

(incl. BTW)

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  • Verzending vanaf 26 januari 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 206,22€ 1,031

*prijsindicatie

RS-stocknr.:
471-197
Fabrikantnummer:
1-917360-0
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

1.25mm

Current

1A

Housing Material

Polyamide 66 Fibreglass

Number of Contacts

10

Number of Rows

1

Orientation

Right Angle

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Tin Plated

Contact Material

Phosphor Bronze

Row Pitch

1.25mm

Termination Type

Solder

Tail Pin Length

3.2mm

Contact Gender

Female

Standards/Approvals

UL 94 V-0

Voltage

50 V

Distrelec Product Id

304-53-579

Land van herkomst:
SG
The TE Connectivity PCB mount receptacle is expertly designed for seamless board-to-board connectivity, featuring a compact 1.25 mm pitch that optimises space without compromising functionality. Built to accommodate varying applications, it excels in delivering reliable connections for signal circuits. The connector's self-aligning feature ensures effortless mating, enhancing user convenience while maintaining robust physical integrity. With an operating voltage of 50 VDC, this product guarantees safe and effective operation in a wide range of electronic devices. Its durable nylon 6/6 GF housing ensures longevity, while the meticulously engineered design enhances performance reliability across diverse industrial applications.

Compact design allows for streamlined circuit layouts

Self-aligning capabilities facilitate easy installation

High insulation resistance enhances electrical safety

Durable materials ensure longevity in demanding environments

Compatible with wave soldering techniques for flexible manufacturing

Low halogen content promotes environmental compliance

Robust retention mechanism secures PCB attachment

Lightweight construction aids in optimising overall device weight

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