TE Connectivity MTA-100 Series Right Angle Board PCB Header, 6 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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€ 240,84

(excl. BTW)

€ 291,42

(incl. BTW)

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  • Verzending vanaf 13 januari 2026
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RS-stocknr.:
470-883
Fabrikantnummer:
2-644803-6
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

MTA-100

Product Type

PCB Header

Pitch

2.54mm

Current

5A

Housing Material

Fibreglass Polyester

Number of Contacts

6

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Minimum Operating Temperature

-55°C

Row Pitch

2.54mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.3mm

Mating Pin Length

5.1mm

Standards/Approvals

CSA LR7189, UL E28476

Voltage

250 V

Distrelec Product Id

304-50-496

Land van herkomst:
CN
The TE Connectivity PCB mount header is designed for a seamless and reliable wire-to-board connection, featuring a right-angle orientation. The fully shrouded header ensures enhanced safety and durability, making it ideal for a variety of applications. Crafted with precision, it supports six positions on a compact 2.54 mm pitch, which optimizes space and improves layout flexibility. The connector caters to various industry needs with its robust construction, including a unique tin plating for improved corrosion resistance. Operating effectively within a temperature range of -55 to 105 °C, it is suitable for diverse environments, ensuring longevity and performance stability. This efficient solution is perfect for those seeking high-quality connectors that meet stringent safety standards.

Right-angle configuration for efficient space management

Six-position design accommodates multiple connection needs

Fully shrouded header provides increased contact protection

Supports a wide operating voltage for versatility in applications

Constructed from premium materials for maximum reliability

Tin-plated contacts enhance resistance to environmental factors

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