InvenSense 9-Axis Surface Mount Accelerometer & Gyroscope, QFN, I2C, SPI, 24-Pin
- RS-stocknr.:
- 218-2214P
- Fabrikantnummer:
- ICM-20948
- Fabrikant:
- InvenSense
Bulkkorting beschikbaar
Subtotaal 100 eenheden (geleverd op een doorlopende strip)*
€ 578,50
(excl. BTW)
€ 700,00
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
- 1.052 stuk(s) klaar voor verzending vanaf een andere locatie
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 100 - 498 | € 5,785 |
| 500 - 998 | € 5,605 |
| 1000 - 2498 | € 5,455 |
| 2500 + | € 5,32 |
*prijsindicatie
- RS-stocknr.:
- 218-2214P
- Fabrikantnummer:
- ICM-20948
- Fabrikant:
- InvenSense
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | InvenSense | |
| Sensor Type | Motion Sensor Module | |
| Number of Axis | 9 | |
| Technology | Digital | |
| Mounting Type | Surface Mount | |
| Interface Type | I2C, SPI | |
| Package Type | QFN | |
| Pin Count | 24 | |
| Alles selecteren | ||
|---|---|---|
Merk InvenSense | ||
Sensor Type Motion Sensor Module | ||
Number of Axis 9 | ||
Technology Digital | ||
Mounting Type Surface Mount | ||
Interface Type I2C, SPI | ||
Package Type QFN | ||
Pin Count 24 | ||
- Land van herkomst:
- TW
The InvenSense ICM series is the worlds lowest power 9-axis motion tracking device that is ideally suited for smartphones, tablets, wearable sensors, and IoT applications. It combines 3-axis gyroscope, 3-axis accelerometer, 3-axis compass, and a digital motion processor. The gyroscope has a programmable full-scale range of ±250 dps, ±500 dps, ±1000 dps, and ±2000 dps. The accelerometer has a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. It also features a 1 KB FIFO that can lower the traffic on the serial bus interface.
Android support
On-chip 16-bit ADCs and programmable filters
Digital-output temperature sensor
MEMS structure hermetically sealed and bonded at wafer level
On-chip 16-bit ADCs and programmable filters
Digital-output temperature sensor
MEMS structure hermetically sealed and bonded at wafer level
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