TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Board Mount DIMM Socket ,1.2 V, 500mA

Subtotaal (1 rol van 400 eenheden)*

€ 577,92

(excl. BTW)

€ 699,28

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Tijdelijk niet op voorraad
  • Verzending vanaf 31 maart 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len)
Per rol
Per stuk*
1 +€ 577,92€ 1,445

*prijsindicatie

RS-stocknr.:
481-965
Artikelnummer Distrelec:
304-59-553
Fabrikantnummer:
2309410-3
Fabrikant:
TE Connectivity
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

TE Connectivity

Product Type

DIMM Socket

Memory Socket Type

DIMM

Insertion/Removal Method

Cam-In

Orientation

Right Angle

Current

500mA

Contact Material

Copper Alloy

Contact Plating

Gold

Number of Contacts

260

Pitch

0.5mm

Mount Type

Board

Housing Material

High Temperature Thermoplastic

Minimum Operating Temperature

-55°C

Termination Type

Surface Mount

Latching

Yes

Row Spacing

8.2mm

Maximum Operating Temperature

85°C

Standards/Approvals

EU ELV Directive 2000/53/EC Out of Scope, UL 94V-0, EU RoHS Directive 2011/65/EU Compliant, EU REACH Regulation (EC) No. 1907/2006, 2016 No Restricted Materials Above Threshold, China RoHS 2 Directive MIIT Order No 32

Series

DDR4 DIMM

Voltage

1.2 V

Land van herkomst:
CN
The TE Connectivity small outline (SO) DIMM socket is designed for high-performance memory applications, ensuring reliable connectivity in compact spaces. With a stack height of just 5.2 mm, this connector accommodates a right-angle module orientation, making it ideal for slim devices where space is at a premium. Its capability to support both 200 and 260 positions allows for flexibility in various DDR4 memory configurations. Engineered to meet stringent quality standards, this socket connection integrates seamlessly into printed circuit boards (PCBs), bolstering stability and performance. Perfectly suited for modern computing needs, this versatile solution is an essential component for efficient data transfer in cutting-edge technology.

Designed for easy surface mount termination

Enhanced reliability with copper alloy contact base material

High-temperature thermoplastic housing for durability in adverse conditions

Retention posts positioned at both ends for secure placement

Locking ejectors ensure stable module engagement

Gerelateerde Links