TE Connectivity 0.6mm Pitch 204 Way, Right Angle Board Mount Mount DDR3 DIMM Socket ,1.5 V ,500mA
- RS-stocknr.:
- 474-377
- Fabrikantnummer:
- 2-2013290-2
- Fabrikant:
- TE Connectivity
Subtotaal (1 rol van 200 eenheden)*
€ 1.119,92
(excl. BTW)
€ 1.355,10
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 15 januari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len) | Per rol | Per stuk* |
|---|---|---|
| 1 + | € 1.119,92 | € 5,60 |
*prijsindicatie
- RS-stocknr.:
- 474-377
- Fabrikantnummer:
- 2-2013290-2
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Memory Socket Type | DIMM Socket | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 204 | |
| Pitch | 0.6mm | |
| Mounting Type | Board Mount | |
| SDRAM Type | DDR3 | |
| Current Rating | 500mA | |
| Voltage Rating | 1.5 V | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Memory Socket Type DIMM Socket | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 204 | ||
Pitch 0.6mm | ||
Mounting Type Board Mount | ||
SDRAM Type DDR3 | ||
Current Rating 500mA | ||
Voltage Rating 1.5 V | ||
- Land van herkomst:
- CN
The TE Connectivity Double data rate (DDR) 3 SO DIMM socket offers a sophisticated solution for memory card connectivity, tailored for modern electronic designs. Featuring a stack height of 5.2 mm and a right-angle module orientation, this connector is designed to fit seamlessly into compact spaces, ensuring efficient performance without compromising on accessibility. With 204 positions, it supports high-density memory modules, making it ideal for applications that demand reliable speed and efficacy. Crafted from high-temperature thermoplastic, its durable housing ensures longevity, while gold plating on contact areas enhances conductivity. This socket is engineered to meet rigorous electrical standards, ensuring it can withstand demanding operational environments.
Designed for high-density memory applications
Optimised for space-constrained layouts
Constructed for exceptional durability and longevity
Gold plating enhances electrical conductivity
Supports operational stability across a wide temperature range
Offers reverse keying to prevent incorrect insertion
Surface mount termination simplifies integration into PCB designs
Suitable for high-performance computing requirements
Optimised for space-constrained layouts
Constructed for exceptional durability and longevity
Gold plating enhances electrical conductivity
Supports operational stability across a wide temperature range
Offers reverse keying to prevent incorrect insertion
Surface mount termination simplifies integration into PCB designs
Suitable for high-performance computing requirements
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