Infineon FP15R12KE3GBPSA1 3 Phase IGBT, 25 A 1200 V AG-ECONO2C-311, Chassis
- RS-stocknr.:
- 258-0857
- Fabrikantnummer:
- FP15R12KE3GBPSA1
- Fabrikant:
- Infineon
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 56,77
(excl. BTW)
€ 68,69
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Op voorraad
- 2 stuk(s) klaar voor verzending vanaf een andere locatie
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 - 1 | € 56,77 |
| 2 - 4 | € 53,93 |
| 5 - 9 | € 51,67 |
| 10 - 19 | € 49,88 |
| 20 + | € 48,65 |
*prijsindicatie
- RS-stocknr.:
- 258-0857
- Fabrikantnummer:
- FP15R12KE3GBPSA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Maximum Continuous Collector Current Ic | 25A | |
| Product Type | IGBT | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 105W | |
| Configuration | 3 Phase | |
| Package Type | AG-ECONO2C-311 | |
| Mount Type | Chassis | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Length | 107.5mm | |
| Height | 17mm | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Maximum Continuous Collector Current Ic 25A | ||
Product Type IGBT | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 105W | ||
Configuration 3 Phase | ||
Package Type AG-ECONO2C-311 | ||
Mount Type Chassis | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Length 107.5mm | ||
Height 17mm | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The Infineon EconoPIM 2 1200V three phase PIM IGBT module with IGBT3 and NTC is optimized customers development cycle time and cost, its fast, reliable and low cost mounting concept.
Low stray inductance module design
High reliability and power density
Copper base plate for optimized heat spread
Solder able pins
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