Infineon FP200R12N3T7BPSA1 3 Phase IGBT, 200 A 1200 V, 46-Pin Module, Chassis Mount
- RS-stocknr.:
- 232-6704
- Fabrikantnummer:
- FP200R12N3T7BPSA1
- Fabrikant:
- Infineon
Subtotaal (1 tray van 10 eenheden)*
€ 1.333,06
(excl. BTW)
€ 1.613,00
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 19 februari 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per tray* |
|---|---|---|
| 10 + | € 133,306 | € 1.333,06 |
*prijsindicatie
- RS-stocknr.:
- 232-6704
- Fabrikantnummer:
- FP200R12N3T7BPSA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Maximum Continuous Collector Current | 200 A | |
| Maximum Collector Emitter Voltage | 1200 V | |
| Maximum Gate Emitter Voltage | ±20V | |
| Number of Transistors | 7 | |
| Maximum Power Dissipation | 20 mW | |
| Package Type | Module | |
| Configuration | 3 Phase | |
| Mounting Type | Chassis Mount | |
| Channel Type | N | |
| Pin Count | 46 | |
| Transistor Configuration | 3 Phase | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Maximum Continuous Collector Current 200 A | ||
Maximum Collector Emitter Voltage 1200 V | ||
Maximum Gate Emitter Voltage ±20V | ||
Number of Transistors 7 | ||
Maximum Power Dissipation 20 mW | ||
Package Type Module | ||
Configuration 3 Phase | ||
Mounting Type Chassis Mount | ||
Channel Type N | ||
Pin Count 46 | ||
Transistor Configuration 3 Phase | ||
The Infineon's EconoPIM 3, 200 A three phase PIM IGBT module comes with TRENCHSTOP IGBT7, Emitter Controlled 7 diode and NTC. The PIM (Power Integrated Modules) with integration of rectifier and brake chopper enables system cost savings. Potential applications include auxiliary inverters, motor drives and servo drives.
RoHS-compliant modules
Copper base plate for optimized heat spread
High power density
Copper base plate for optimized heat spread
High power density
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