TE Connectivity 2.54mm Pitch 16 Way Through Hole DIP IC Socket
- RS-stocknr.:
- 478-503
- Fabrikantnummer:
- 2-1437539-8
- Fabrikant:
- TE Connectivity
Subtotaal (1 verpakking van 120 eenheden)*
€ 229,92
(excl. BTW)
€ 278,20
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 26 januari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en) | Per verpakking | Per stuk* |
|---|---|---|
| 1 + | € 229,92 | € 1,916 |
*prijsindicatie
- RS-stocknr.:
- 478-503
- Fabrikantnummer:
- 2-1437539-8
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Package Type | DIP | |
| Number of Contacts | 16 | |
| Number of Rows | 2 | |
| Pitch | 2.54mm | |
| Socket Mounting Type | Through Hole | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Package Type DIP | ||
Number of Contacts 16 | ||
Number of Rows 2 | ||
Pitch 2.54mm | ||
Socket Mounting Type Through Hole | ||
Niet conform
- Land van herkomst:
- CH
The TE Connectivity Socket assembly is a highly efficient and reliable DIP socket designed for seamless integration with printed circuit boards. Engineered to accommodate 16 positions, this standard socket offers optimal performance in various electronic applications. Its robust open frame style facilitates easy insertion and removal of ICs, while the stamped and formed contact fabrication ensures a strong electrical connection. The combination of gold plating on the contact mating area enhances durability and conductance, making this socket ideal for demanding environments. With a vertical PCB mount orientation, this component is well-suited for space-constrained designs, ensuring that you can maximise functionality without compromising on device footprint.
Designed for standard, stamped and formed applications
Features gold plating for superior conductivity and durability
Offers easy integration with vertical PCB mount orientation
Optimised for 16 positions to support multiple applications
Provides reliable wave soldering capabilities
Facilitates enhanced electrical performance in various environments
Streamlined open frame design allows for quick IC changes
Supports widespread usage across various electronic manufacturing sectors
Features gold plating for superior conductivity and durability
Offers easy integration with vertical PCB mount orientation
Optimised for 16 positions to support multiple applications
Provides reliable wave soldering capabilities
Facilitates enhanced electrical performance in various environments
Streamlined open frame design allows for quick IC changes
Supports widespread usage across various electronic manufacturing sectors
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