TE Connectivity 1366 Way SMT LGA Prototyping IC Socket
- RS-stocknr.:
- 478-437
- Fabrikantnummer:
- 1981467-1
- Fabrikant:
- TE Connectivity
Subtotaal (1 verpakking van 6 eenheden)*
€ 254,77
(excl. BTW)
€ 308,27
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 26 januari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en) | Per verpakking | Per stuk* |
|---|---|---|
| 1 + | € 254,77 | € 42,462 |
*prijsindicatie
- RS-stocknr.:
- 478-437
- Fabrikantnummer:
- 1981467-1
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Package Type | LGA | |
| IC Socket Type | Prototyping Socket | |
| Number of Contacts | 1366 | |
| Socket Mounting Type | Surface Mount | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Package Type LGA | ||
IC Socket Type Prototyping Socket | ||
Number of Contacts 1366 | ||
Socket Mounting Type Surface Mount | ||
- Land van herkomst:
- CN
The TE Connectivity Stiffener plate assembly is meticulously designed to cater to LGA1366 processor requirements, providing robust support and stability. Engineered with precision, the product ensures that critical components remain secure during operation, thereby enhancing performance and reliability. Its construction not only addresses physical integrity but also promotes optimal thermal management. As a reliable solution for demanding applications, this assembly effectively mitigates potential risks associated with component misalignment. The clear documentation further establishes its compliance with stringent industry standards, ensuring peace of mind for users. Elevate your system's capabilities with a well-conceived accessory that seamlessly integrates into existing setups, ultimately extending the lifecycle of your hardware.
Constructed to enhance stability for LGA1366 processors
Facilitates optimal thermal management during operation
Supports secure component alignment to mitigate risks
Complies with EU RoHS and ELV directives for safety
Backed by comprehensive technical documentation
Offers an excellent solution for longevity in demanding applications
Facilitates optimal thermal management during operation
Supports secure component alignment to mitigate risks
Complies with EU RoHS and ELV directives for safety
Backed by comprehensive technical documentation
Offers an excellent solution for longevity in demanding applications
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