Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, TSSOP 56 to DIP 56
- RS-stocknr.:
- 741-9460
- Fabrikantnummer:
- W9595RC
- Fabrikant:
- Winslow
Afbeelding representeert productcategorie
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 41,57
(excl. BTW)
€ 50,30
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
- 4 stuk(s) klaar voor verzending vanaf een andere locatie
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Aantal stuks | Per stuk |
|---|---|
| 1 - 24 | € 41,57 |
| 25 - 74 | € 37,42 |
| 75 - 199 | € 33,25 |
| 200 - 399 | € 29,11 |
| 400 + | € 27,03 |
*prijsindicatie
- RS-stocknr.:
- 741-9460
- Fabrikantnummer:
- W9595RC
- Fabrikant:
- Winslow
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Winslow | |
| Pitch | 0.5 mm, 2.54 mm | |
| End 1 | TSSOP 56 | |
| End 2 | DIP 56 | |
| End 1 Number of Contacts | 56 | |
| End 2 Number of Contacts | 56 | |
| End 1 Type | TSSOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Alles selecteren | ||
|---|---|---|
Merk Winslow | ||
Pitch 0.5 mm, 2.54 mm | ||
End 1 TSSOP 56 | ||
End 2 DIP 56 | ||
End 1 Number of Contacts 56 | ||
End 2 Number of Contacts 56 | ||
End 1 Type TSSOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- Land van herkomst:
- GB
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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