Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 16 Pin Female SOP to 16 Pin Male DIP
- RS Stock No.:
- 741-9401
- Mfr. Part No.:
- W9503-2RC
- Brand:
- Winslow
Bulk discount available
Subtotal (1 pack of 5 units)*
€ 78,04
(exc. VAT)
€ 94,43
(inc. VAT)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
- Plus verzending 100 stuk(s) vanaf 15 december 2025
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Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 120 | € 15,608 | € 78,04 |
| 125 - 370 | € 14,05 | € 70,25 |
| 375 - 995 | € 12,49 | € 62,45 |
| 1000 - 1995 | € 10,922 | € 54,61 |
| 2000 + | € 10,146 | € 50,73 |
*price indicative
- RS Stock No.:
- 741-9401
- Mfr. Part No.:
- W9503-2RC
- Brand:
- Winslow
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Merk | Winslow | |
| Pitch | 1.27 mm, 2.54 mm | |
| End 1 | 16 Pin Female SOP | |
| End 2 | 16 Pin Male DIP | |
| End 1 Number of Contacts | 16 | |
| End 2 Number of Contacts | 16 | |
| End 1 Type | SOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Merk Winslow | ||
Pitch 1.27 mm, 2.54 mm | ||
End 1 16 Pin Female SOP | ||
End 2 16 Pin Male DIP | ||
End 1 Number of Contacts 16 | ||
End 2 Number of Contacts 16 | ||
End 1 Type SOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Related links
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