AAVID THERMALLOY Heatsink, Hexfet MOSFETs, Semiconductor Packages, Power Semiconductors, 2.3°C/W 60 mm 100 mm 27 mm
- RS-stocknr.:
- 712-4399
- Fabrikantnummer:
- 0S579/100/B
- Fabrikant:
- AAVID THERMALLOY
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- RS-stocknr.:
- 712-4399
- Fabrikantnummer:
- 0S579/100/B
- Fabrikant:
- AAVID THERMALLOY
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
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Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | AAVID THERMALLOY | |
| Product Type | Heatsink | |
| For Use With | Hexfet MOSFETs, Semiconductor Packages, Power Semiconductors | |
| Length | 100mm | |
| Width | 27 mm | |
| Height | 60mm | |
| Thermal Resistance | 2.3°C/W | |
| Fastening | Clip | |
| Series | THE MAX CLIP SYSTEM | |
| Colour | Black Anodised | |
| Finish | Black Anodised | |
| Compatible Package Type | TO-247, TO-0218, TO-220, TO-0220, TO-247J | |
| Standards/Approvals | U.S. Patent 5.991.151 | |
| Application | Cooling | |
| Material | Special Spring Steel, Nickel Plated | |
| Special Features | High Elasticity, Easy to Assemble/Disassemble, Vibration Resistance, Constant Pressure, Corrosion Resistance | |
| Alles selecteren | ||
|---|---|---|
Merk AAVID THERMALLOY | ||
Product Type Heatsink | ||
For Use With Hexfet MOSFETs, Semiconductor Packages, Power Semiconductors | ||
Length 100mm | ||
Width 27 mm | ||
Height 60mm | ||
Thermal Resistance 2.3°C/W | ||
Fastening Clip | ||
Series THE MAX CLIP SYSTEM | ||
Colour Black Anodised | ||
Finish Black Anodised | ||
Compatible Package Type TO-247, TO-0218, TO-220, TO-0220, TO-247J | ||
Standards/Approvals U.S. Patent 5.991.151 | ||
Application Cooling | ||
Material Special Spring Steel, Nickel Plated | ||
Special Features High Elasticity, Easy to Assemble/Disassemble, Vibration Resistance, Constant Pressure, Corrosion Resistance | ||
The Max Clip System™ OS579 Profile
Clip mounting technology offers high reliability
Economic and manufacturing benefits that replace rivets and screws
Simplified and rapid assembly for mounting a semiconductor to the heatsink
Improved performance with the use of special thermal interface materials
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