Fischer Elektronik Heatsink, Universal Rectangular Alu with Fan 93 mm 150 mm 92 mm
- RS-stocknr.:
- 692-0607
- Fabrikantnummer:
- LA 21 150 24 V
- Fabrikant:
- Fischer Elektronik
Subtotaal (1 eenheid)*
€ 363,17
(excl. BTW)
€ 439,44
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
- 19 stuk(s) klaar voor verzending
Aantal stuks | Per stuk |
|---|---|
| 1 - 1 | € 363,17 |
| 2 - 4 | € 352,27 |
| 5 - 9 | € 345,01 |
| 10 + | € 334,11 |
*prijsindicatie
- RS-stocknr.:
- 692-0607
- Fabrikantnummer:
- LA 21 150 24 V
- Fabrikant:
- Fischer Elektronik
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Rectangular Alu with Fan | |
| Length | 150mm | |
| Width | 92 mm | |
| Height | 93mm | |
| Finish | Black Anodised | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Cooling | |
| Special Features | Extremely Low Losses Due to Optimised Hollow Fin Geometry, Hollow Fin Geometry for Optimised Airflow, Additional Treatment Upon Customer's Request, High Performance Density Due to Large Heat-Conducting Surfaces, Two Opposite Mounting Surfaces Are Milled Flat Without Air Flow Chamber, With Air Flow Chamber, Compact Construction, Semiconductor Mounting Surface for Milled Flat, Particularly Effective Heat Dissipation, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Only Effective With Forced Ventilation by Means of the Fan but Not With Free Convection | |
| Alles selecteren | ||
|---|---|---|
Merk Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Rectangular Alu with Fan | ||
Length 150mm | ||
Width 92 mm | ||
Height 93mm | ||
Finish Black Anodised | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Cooling | ||
Special Features Extremely Low Losses Due to Optimised Hollow Fin Geometry, Hollow Fin Geometry for Optimised Airflow, Additional Treatment Upon Customer's Request, High Performance Density Due to Large Heat-Conducting Surfaces, Two Opposite Mounting Surfaces Are Milled Flat Without Air Flow Chamber, With Air Flow Chamber, Compact Construction, Semiconductor Mounting Surface for Milled Flat, Particularly Effective Heat Dissipation, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Only Effective With Forced Ventilation by Means of the Fan but Not With Free Convection | ||
- Land van herkomst:
- HU