TE Connectivity Heatsink, XFP Cages

The TE Connectivity Heat Sink is meticulously designed to optimise cooling for high-performance applications. Ideal for use with XFP devices, this product features a pin fin configuration with 60 fins to ensure superior heat dissipation. Crafted from durable aluminium and finished with nickel plating, it not only guarantees reliability but also enhances the overall aesthetic of your setup. Specifically engineered to meet stringent compliance standards, this heat sink is an excellent choice for demanding environments. Whether you are looking to boost device efficiency or improve thermal management, this product stands out with its robust construction and thoughtful design tailored for modern connectivity solutions.

Optimised for high-performance XFP device cooling
Constructed from lightweight yet sturdy aluminium material
Nickel plating enhances corrosion resistance and longevity
Pin fin design maximises airflow, ensuring efficient heat dissipation
Compliant with EU RoHS and ELV directives for safety and environmental standards
Compatible with various connectors and accessories for versatile applications
Ensures reliable performance in demanding electronic environments