Transcend MTE370T M.2 (2230) 256 GB Internal SSD
- RS-stocknr.:
- 262-9711
- Fabrikantnummer:
- TS256GMTE370T
- Fabrikant:
- Transcend
Tekort aan voorraad
Vanwege een wereldwijd voorraadtekort, weten we niet wanneer dit weer voorradig zal zijn.
- RS-stocknr.:
- 262-9711
- Fabrikantnummer:
- TS256GMTE370T
- Fabrikant:
- Transcend
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Transcend | |
| Model Number | MTE370T | |
| Memory Size | 256GB | |
| Product Type | SSD | |
| Internal/External | Internal | |
| Form Factor | M.2 (2230) | |
| Industrial Grade | Yes | |
| NAND Type | 3D TLC | |
| Interface Type | PCIe Gen 3.0 x4 NVMe | |
| Minimum Operating Temperature | -20°C | |
| Maximum Operating Temperature | 75°C | |
| Standards/Approvals | PCI Express specification 3.1, RoHS 2.0, NVM Express specification 1.3 | |
| Alles selecteren | ||
|---|---|---|
Merk Transcend | ||
Model Number MTE370T | ||
Memory Size 256GB | ||
Product Type SSD | ||
Internal/External Internal | ||
Form Factor M.2 (2230) | ||
Industrial Grade Yes | ||
NAND Type 3D TLC | ||
Interface Type PCIe Gen 3.0 x4 NVMe | ||
Minimum Operating Temperature -20°C | ||
Maximum Operating Temperature 75°C | ||
Standards/Approvals PCI Express specification 3.1, RoHS 2.0, NVM Express specification 1.3 | ||
Vrijgesteld
Transcend 256GB M.2 2230 PCIe gen3 x4 SSD - MTE370T
Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D
NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The
MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3
specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond
technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an
endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃.
Hardware Features
Compliant with RoHS 2.0 standards Compliant with NVM Express specification 1.3 Compliant with PCI Express specification 3.1 Space-saving M.2 form factor (30mm) – ideal for mobile computing devices Single-sided to fit perfectly in small form factor devices
Firmware Features
Supports NVM command SLC caching technology Dynamic thermal throttling Built-in LDPC ECC (Error Correction Code) functionality Advanced Garbage Collection
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