Molex, 54550 0.5 mm Pitch 4 Way Right Angle FPC Connector, Surface Mount
- RS-stocknr.:
- 795-600
- Fabrikantnummer:
- 54550-0471
- Fabrikant:
- Molex
Subtotaal (1 rol van 3000 eenheden)*
€ 2.507,95
(excl. BTW)
€ 3.034,62
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 23 november 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len) | Per rol | Per stuk* |
|---|---|---|
| 1 + | € 2.507,95 | € 0,836 |
*prijsindicatie
- RS-stocknr.:
- 795-600
- Fabrikantnummer:
- 54550-0471
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Product Type | FPC Connector | |
| Number of Contacts | 4 | |
| Sub Type | Slider Pad | |
| Contact Material | Phosphor Bronze | |
| Pitch | 0.5mm | |
| Current | 0.5A | |
| Mount Type | Surface | |
| Contact Position | Top | |
| Termination Type | Surface Mount | |
| Orientation | Right Angle | |
| Voltage | 50V | |
| Series | 54550 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Number of Rows | 1 | |
| Standards/Approvals | UL | |
| Contact Plating | Tin | |
| Housing Material | Liquid Crystal Polymer | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Product Type FPC Connector | ||
Number of Contacts 4 | ||
Sub Type Slider Pad | ||
Contact Material Phosphor Bronze | ||
Pitch 0.5mm | ||
Current 0.5A | ||
Mount Type Surface | ||
Contact Position Top | ||
Termination Type Surface Mount | ||
Orientation Right Angle | ||
Voltage 50V | ||
Series 54550 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Number of Rows 1 | ||
Standards/Approvals UL | ||
Contact Plating Tin | ||
Housing Material Liquid Crystal Polymer | ||
- Land van herkomst:
- CN
The Molex connector series offers a reliable solution is designed for circuit connectivity. Its Compact structure facilitates efficient integration into various applications, ensuring stable performance in demanding environments.
Recommended base film thickness of 25μm enhances durability
Utilises soft copper foil of 35μm or 50μm for superior conductivity
Meets ELV and RoHS compliance standards for environmental safety
Features thermosetting adhesive for robust bonding performance
Designed for optimal performance in FPC/FFC applications
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