Infineon NOR 256 MB SPI FL-S Flash 24-Pin BGA, S25FL256SAGBHI200

RS-stocknr.:: 273-7498
Fabrikantnummer:: S25FL256SAGBHI200
Fabrikant:: Infineon

Infineon NOR 256 MB SPI FL-S Flash 24-Pin BGA, S25FL256SAGBHI200

Bulkkorting beschikbaar

Bekijk bulkkorting

Subtotaal (1 tray van 338 eenheden)*

€ 1.121,82

(excl. BTW)

€ 1.357,41

(incl. BTW)

GRATIS bezorging voor bestellingen vanaf € 90,00

Tijdelijk niet op voorraad

Verzending vanaf 08 april 2027

Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.

Aantal stuks	Per stuk	Per tray*
338 - 338	€ 3,319	€ 1.121,82
676 +	€ 3,236	€ 1.093,77

*prijsindicatie

RS-stocknr.:: 273-7498
Fabrikantnummer:: S25FL256SAGBHI200
Fabrikant:: Infineon

Specificaties

Datasheets

Wetgeving en conformiteit

Productomschrijving

Zoek vergelijkbare producten door een of meer kenmerken te selecteren.

Alles selecteren	Attribuut	Waarde
	Merk	Infineon
	Product Type	FL-S Flash
	Memory Size	256MB
	Interface Type	SPI
	Package Type	BGA
	Pin Count	24
	Maximum Clock Frequency	133MHz
	Cell Type	NOR
	Maximum Supply Voltage	3.6V
	Minimum Supply Voltage	2.7V
	Timing Type	DDR
	Minimum Operating Temperature	-40°C
	Maximum Operating Temperature	+85°C
	Standards/Approvals	RoHS
	Supply Current	16mA
	Series	S25FL
	Automotive Standard	AEC-Q100

	Alles selecteren
	Merk Infineon
	Product Type FL-S Flash
	Memory Size 256MB
	Interface Type SPI
	Package Type BGA
	Pin Count 24
	Maximum Clock Frequency 133MHz
	Cell Type NOR
	Maximum Supply Voltage 3.6V
	Minimum Supply Voltage 2.7V
	Timing Type DDR
	Minimum Operating Temperature -40°C
	Maximum Operating Temperature +85°C
	Standards/Approvals RoHS
	Supply Current 16mA
	Series S25FL
	Automotive Standard AEC-Q100

Datasheet - S25FL256SAGBHI200

Infineon S25FL Series FL-S Flash, 256MB Memory Size, 133MHz Maximum Clock Frequency - S25FL256SAGBHI200

This FL-S flash device is a high-density SPI NOR memory intended for demanding embedded and automotive environments. It operates across a wide temperature range suited to harsh conditions and uses a ball grid array package to support Compact board layouts. The device delivers synchronous DDR timing for Rapid data transfer and connects via a serial peripheral Interface for system storage and code execution tasks.

Features and Benefits:

• 256MB memory capacity enables large firmware and data storage
• 133MHz clock rate supports high-throughput read operations
• DDR timing improves effective data bandwidth during transfers
• 2.7V to 3.6V supply range allows flexible power-rail integration
• -40°C to +85°C rating sustains operation in extreme temperatures

Applications

• Suitable for automotive control unit code storage
• Ideal for industrial instrumentation firmware retention
• Used with high-speed data-logging systems
• Can be used for boot storage in Compact electronics
• Used for in-vehicle infotainment resource storage

What package type does this device use?

It is supplied in a BGA package to facilitate high-density mounting.

How much current does it draw during normal operation?

Typical supply current is 16mA during Active operation.

Which Interface does it use for communication?

The device communicates over an SPI Interface with DDR timing.

Is the device suitable for automotive qualification?

It meets the AEC-Q100 automotive standard for electronic components.

What regulatory restriction does it comply with?

It is RoHS-compliant for restricted substance adherence.