82009, Novolack, O-Naphto-Chinon-Diazide Etching Chemical for Etching in Liquid

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RS-stocknr.:
173-886
Fabrikantnummer:
82009
Fabrikant:
Kontakt Chemie
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Merk

Kontakt Chemie

Process Type

Etching

Material

Novolack, O-Naphto-Chinon-Diazide

Ferric Chloride Form

Liquid

Trade Name

POSITIV 20

Land van herkomst:
BE

CRC Etching Chemical, Liquid Ferric Chloride Form, Novolack - 82009


This etching chemical is a liquid photo-positive resist designed for use in PCB production. Made from a composition of Novolack and O-Naphto-Chinon-Diazide, it effectively transfers patterns onto various substrates. The sensitive formulation allows for high precision in chemical etching processes, ensuring that electrical circuits remain intact after application.

Features & Benefits


• Resists strong acidic etching while allowing easy removal
• Maximum photo-sensitivity in the UV-A wavelength range
• Designed for application in dark or yellow light settings
• Suitable for both metal and glass lithographic projects
• Ensures accurate pattern transfer on circuit boards
• Enables effective etching of copper and brass materials

Applications


• Utilised for printed circuit board production
• Applied in photo-lithographic processes on metals
• Suitable for glass etching
• Used in creating durable inscriptions or graphics

How should surfaces be prepared before application?


Surfaces must be cleaned of grease and oxides, ideally using a water-based cleaning process, with final rinses in deionised water to ensure full wettability.

What is the recommended drying process after coating?


Post-coating, boards should be dried in the dark, with temperatures gradually raised to 70°C and maintained for 15 minutes to ensure optimal film quality.

How is the developing process carried out after exposure?


The exposed plate should be immersed in a sodium hydroxide bath for approximately 60 seconds to dissolve the exposed lacquer, followed by thorough rinsing in water.

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