STMicroelectronics, 64 kB Serial EEPROM, 450 ns 5-Pin UFDFPN Serial-I2C

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RS-stocknr.:
239-6327
Fabrikantnummer:
M24C64-FMH6TG
Fabrikant:
STMicroelectronics
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Merk

STMicroelectronics

Memory Size

64kB

Product Type

Serial EEPROM

Interface Type

Serial-I2C

Package Type

UFDFPN

Mount Type

Surface

Pin Count

5

Organisation

8K x 8 bit

Maximum Clock Frequency

1MHz

Minimum Supply Voltage

1.7V

Maximum Supply Voltage

5.5V

Number of Bits per Word

8

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Length

1.7mm

Width

1.4 mm

Series

M24C64-F

Height

0.55mm

Standards/Approvals

No

Data Retention

200year

Automotive Standard

AEC-Q100

Number of Words

8K

Maximum Random Access Time

450ns

64-Kbit serial I²C bus EEPROM


Description


The M24C64 is a 64-Kbit I²C-compatible EEPROM (electrically erasable programmable memory) organized as 8K x 8 bits.

Over an ambient temperature range of -40 °C / +85 °C, the M24C64-W can operate with a supply voltage from 2.5 V to 5.5 V, the M24C64-R can operate with a supply voltage from 1.8 V to 5.5 V, and the M24C64-F and M24C64-DF can operate with a supply voltage from 1.7 V to 5.5 V ( the M24C64-F can also operate down to 1.6 V, under some restricting conditions).

The M24C64-D offers an additional page, named the identification page (32 byte). The identification page can be used to store sensitive application parameters which can be (later) permanently locked in read-only mode.

Features


Compatible with following I²C bus modes:

1 MHz

400 kHz

100 kHz

Memory array:

64 Kbit (8 Kbyte) of EEPROM

Page size: 32 byte

Additional Write lockable page (M24C64-D order codes)

Single supply voltage:

1.7 V to 5.5 V over –40 °C / +85 °C

1.6 V to 5.5 V over 0 °C / +85 °C

Write:

Byte write within 5 ms

Page write within 5 ms

Random and sequential read modes

Write protect of the whole memory array

Enhanced ESD/latch-Up protection

More than 4 million write cycles

More than 200-years data retention

Packages

SO8N (ECOPACK2)

TSSOP8 (ECOPACK2)

UFDFPN (ECOPACK2)

WLCSP (ECOPACK2)

Unsawn wafer (each die is tested)

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